Get ready for an electrifying dive into the future of semiconductor design at the 2025 TSMC Global Open Innovation Platform® (OIP) Ecosystem Forum! This isn't just an event; it's a dynamic hub where the brightest minds converge to ignite the next wave of innovation.
As the AI revolution proliferates from the data center to the edge and becomes integrated into every application, the need for high-performance and energy-efficient designs is becoming paramount. Through a series of compelling, multi-track presentations, you'll gain a firsthand understanding of how the ecosystem is collaboratively tackling these critical design requirements.
AI is also transforming how chip and multi-die designs are done. This year, the forum will highlight how the ecosystem is harnessing the immense potential of AI in next generation of design solutions for TSMC’s advanced process and packaging technologies. Prepare to be immersed in a wealth of knowledge as industry trailblazers and TSMC's ecosystem partners offer valuable insights into the latest breakthroughs.
The event provides a unique opportunity for you to engage with thought leaders and innovators, whether you join in-person at locations across North America, Japan, Taiwan, China, and Europe, or participate online.
Don't miss this opportunity to connect with the leading players of semiconductor technology and be part of shaping tomorrow's innovations, today!